Performance characteristics of p-channel FinFETs with varied Si-fin extension lengths for source and drain contacts
Liaw Yue-Gie1, Liao Wen-Shiang2,3, Wang Mu-Chun4, Chen Chii-Wen4, Li Deshi2, Gu Haoshuang3, Zou Xuecheng1
1Department of Electronic Science & Technology, Huazhong University of Science and Technology, Wuhan, P. R. China
2Faculty of School of Electronic Information, Wuhan University, Wuhan, P.R. China
3Faculty of Physics and Electronic Technology, Hubei University, Wuhan, P.R. China
4Department of Electronic Engineering, Ming Hsin University of Science and Technology, Hsinchu, Taiwan
Email: wsliaoumc@yahoo.com.tw, mucwang@must.edu.tw, estxczou@hust.edu.cт
Выставление онлайн: 19 ноября 2017 г.
The length of Source/Drain (S/D) extension (LSDE) of nano-node p-channel FinFETs (pFinFETs) on SOI wafer influencing the device performance is exposed, especially in drive current and gate/S/D leakage. In observation, the longer LSDE pFinFET provides a larger series resistance and degrades the drive current (IDS), but the isolation capability between the S/D contacts and the gate electrode is increased. The shorter LSDE plus the shorter channel length demonstrates a higher trans-conductance (Gm) contributing to a higher drive current. Moreover, the subthreshold swing (S.S.) at longer channel length and longer LSDE represents a higher value indicating the higher amount of the interface states which possibly deteriorate the channel mobility causing the lower drive current. DOI: 10.21883/FTP.2017.12.45190.8421
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