ФТП, 2007, том 41, выпуск 4

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Combined CL/EBIC/DLTS investigation of a regular dislocation network formed by Si wafer direct bonding

X.Yu\kern1pt*,+, O.Vyvenko\kern1pt+,o, M.Kittler\kern1pt*,+, W.Seifert\kern1pt*,+, T.Mtchedlidze\kern1pt+, T.Arguirov\kern1pt*,+, M.Reiche\kern1pt=/=

*IHP,
15236 Frankfurt (Oder), Germany
+ IHP/BTU Joint Lab,
03046 Cottbus, Germany
=/= MPI fur Mikrostrukturphysik,
06120 Halle, Germany
o St. Petersburg State University,
198504 St. Petersburg, Russia

(Получена 12 сентября 2006 г. Принята к печати 3 октября 2006 г.)

Electrical levels of the dislocation network in Si and recombination processes via these levels were studied by means of the combination of grain-boundary deep level transient spectroscopy, grain-boundary electron beam induced current (GB-EBIC) and cathodoluminescence (CL). It was found two deep level traps and one shallow trap existed at the interface of bonded interface, which supply the recombination centers fo carriers. The total recombination probability based on GB-EBIC data increased with the excitation level monotonically, however, the radiative recombination based on D1--D2 CL data exhibited a maximum at a certain excitation level. By applying an external bias across the bonded interface, the CL signal of D-lines was enhanced dramatically. These results are consistent with our models about two channels of recombination via the trap levels.

PACS: 68.37.Hk, 71.55.Cn, 78.60.Hk

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