Features of the course of the solid-state reactions in a Sn/Fe/Cu trilayer film system
Balashov Yu. Yu.1, Myagkov V. G.1, Bykova L. E.1, Volochaev M. N.1, Zhigalov V. S.1, Matsynin A. A.1, Galushka K. A.2, Bondarenko G. N.1, Komogortsev S. V. 1
1Kirensky Institute of Physics, Federal Research Center KSC SB, Russian Academy of Sciences, Krasnoyarsk, Russia
2Siberian State University, Krasnoyarsk, Russia
Email: Y.balashov@yandex.ru, lebyk@iph.krasn.ru, volochaev91@mail.ru, zhigalov@iph.krasn.ru, matsyninaa@gmail.com, dir_efir@sfu-kras.ru, komogor@iph.krasn.ru

Study of the mechanisms of the solid-state reactions in Sn/Fe/Cu thin films is interesting both from a fundamental point of view and from a view of the importance of emerging intermetallics in the technology of solder joints and thin-film lithium-ion batteries. By the integrated approach, including both X-ray phase analysis and local elemental analysis of the cross-sections of the films, the phase composition and the mutual arrangement of phases were studied, at various stages of the solid-state reaction occurring at different temperatures. The observed sequence of the appearing phases differs significantly from the expected one if the mass transfer took place by a volume diffusion through the forming layers. Keywords: thin films, transmission electron microscopy, energy dispersion spectroscopy, mass transfer mechanisms. DOI: 10.61011/TP.2023.07.56642.73-23
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