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Features of the course of the solid-state reactions in a Sn/Fe/Cu trilayer film system
Balashov Yu. Yu.1, Myagkov V. G.1, Bykova L. E.1, Volochaev M. N.1, Zhigalov V. S.1, Matsynin A. A.1, Galushka K. A.2, Bondarenko G. N.1, Komogortsev S. V.
1
1Kirensky Institute of Physics, Federal Research Center KSC SB, Russian Academy of Sciences, Krasnoyarsk, Russia
2Siberian Federal University, Krasnoyarsk, Russia
2Siberian Federal University, Krasnoyarsk, Russia
Email: Y.balashov@yandex.ru, lebyk@iph.krasn.ru, volochaev91@mail.ru, zhigalov@iph.krasn.ru, matsyninaa@gmail.com, dir_efir@sfu-kras.ru, komogor@iph.krasn.ru
Study of the mechanisms of the solid-state reactions in Sn/Fe/Cu thin films is interesting both from a fundamental point of view and from a view of the importance of emerging intermetallics in the technology of solder joints and thin-film lithium-ion batteries. By the integrated approach, including both X-ray phase analysis and local elemental analysis of the cross-sections of the films, the phase composition and the mutual arrangement of phases were studied, at various stages of the solid-state reaction occurring at different temperatures. The observed sequence of the appearing phases differs significantly from the expected one if the mass transfer took place by a volume diffusion through the forming layers. Keywords: thin films, transmission electron microscopy, energy dispersion spectroscopy, mass transfer mechanisms. DOI: 10.61011/TP.2023.07.56642.73-23
- V.G. Myagkov, L.E. Bykova, A.A. Matsynin, M.N. Volochaev, V.S. Zhigalov, I.A. Tambasov, Yu.L. Mikhlin, D.A. Velikanov, G.N. Bondarenko. J. Solid State Chem., 246, 379 (2017). DOI: 10.1016/j.jssc.2016.12.010
- E.G. Colgan. Mater. Sci. Reports, 5, 1 (1990). DOI: 10.1016/S0920-2307(05)80005-2
- D.P. Adams. Thin Solid Films, 576, 98 (2015). DOI: 10.1016/j.tsf.2014.09.042
- V. Myagkov, O. Bayukov, Yu. Mikhlin, V. Zhigalov, L. Bykova, G. Bondarenko. Philos. Mag., 94, 2595 (2014). DOI: 10.1080/14786435.2014.926037
- J. Gorlich, G. Schmitz, K.N. Tu. Appl. Phys. Lett., 86, 053106 (2005). DOI: 10.1063/1.1852724
- Y.Q. Wu, S.D. McDonald, J. Read, H. Huang, K. Nogita. Scripta Mater., 68, 595 (2013). DOI: 10.1016/j.scriptamat.2012.12.012
- P.Y. Chia, A.S.M.A. Haseeb. J. Mater Sci: Mat. Electron., 26, 294 (2015). DOI: 10.1007/s10854-014-2398-9
- W.H. Pu, X.M. He, J.G. Ren, C.R. Wan, C.Y. Jiang. Electrochim. Acta., 50, 4140 (2005). DOI: 10.1016/j.electacta.2005.01.041
- O. Mao, R.A. Dunlap, J.R. Dahn. J. Electrochem. Soc., 146, 405 (1999). DOI: 10.1149/1.1391622
- O. Mao, J.R. Dahn. J. Electrochem. Soc., 146, 414 (1999). DOI: 10.1007/s10854-014-2398-9
- H. Shao, A. Wu, Y. Bao, Y. Zhao, G. Zou, L. Liu. Microelectron. Reliability, 91, 38 (2018). DOI: 10.1016/j.microrel.2018.08.004
- V.G. Myagkov, V.S. Zhigalov, L.E. Bykova, L.A. Solovyov, A.A. Matsynin, Yu.Yu. Balashov, I.V. Nemtsev, A.V. Shabanov, G.N. Bondarenko. J. Mater. Res., 36, 3121 (2021). DOI: 10.1557/s43578-021-00312-4
- L.E. Bykova, S.M. Zharkov, V.G. Myagkov, Yu.Yu. Balashov, G.S. Patrin. Phys. Solid State, 64 (2), 33 (2022). DOI: 10.21883/FTT.2021.12.51685.139
- L.E. Bykova, V.G. Myagkov, Y.Y. Balashov, V.S. Zhigalov, G.S. Patrin. J. Sib. Fed. Univ. Math. Phys., 15 (4), 493 (2022). DOI: 10.17516/1997-1397-2022-15-4-493-499
- J.M. Purswani, T. Spila, D. Gall. Thin Solid Films, 515, 1166 (2006). DOI: 10.1016/j.tsf.2006.07.142
- K.N. Tu, R.D. Thompson. Acta Metall, 30, 947 (1982). DOI: 10.1016/0001-6160(82)90201-2
- M. Hida, M. Kajihara. Mater. Trans., 53, 1240 (2012). DOI: 10.2320/matertrans.M2012060
- V. Vuorinen, T. Laurila, T. Mattila, E. Heikinheimo, J.K. Kivilahti. J. Electron. Mater., 36, 1355 (2007). DOI: 10.1007/s11664-007-0251-0
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