The effect of shear stress on the creep kinetics of Cu (99.95 %) in the temperature range from 373 to 923 K is considered. A coincidence of internal stress estimates obtained using different methods was found, which confirmed the correctness of the creep kinetic equation chosen for data analysis and also made it possible to exclude the effect of deformation point defects, impurity atoms, and piel up of dislocations on the internal stress. It is shown that in the region of relatively high stresses, where the exponential dependence of the creep rate on stress is fulfilled, creep is controlled by self-diffusion, and at high temperatures in the region of the power dependence, it is controlled by diffusion along dislocation cores. In the intermediate temperature region, a change in the slope of the creep rate dependences on stress is observed, while the activation parameters decrease: the self-diffusion energy to diffusion along dislocation cores, and the activation volume value decreases by 3 times. It is concluded that the mechanism of plastic deformation of copper at intermediate test temperatures changes depending on the temperature, the magnitude of the applied stress and the magnitude of the internal stress caused by strain hardening. Keywords: shear stresses, dislocation density, activation energy, activation volume, self-diffusion, diffusion along dislocation cores, deformation mechanism.

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